Exploring Asterfusion low latency data center switch from 2Tbps to 12.8Tbps
Asterfusion offers 2 Tbps -12.8 Tbps data centers’ leaf and spine switch based on Teralynx chip, it preloaded with SONiC enterprise distribution which provides users a simple, plug-and-play deployment and turnkey solution.
Industry-leading low latency SONiC switch based on Marvell Teralynx, essential by distributed storage, AI applications and HPC, NVME.
Highest Scale and Radix Solutions
- Up to 128x 100GbE, 64x 100G + 16 x 400G or 32x 400GbE.
- Up to 12.8T switch capacity.
Leading Performance/$ and Performance/W
- The largest on-chip buffer among similar switches, providing first-class microburst elimination.
- Robust tunneling features with VXLAN/MPLS.
- Powerful QoS features for RoCEv2/RDMA, easy to use with both CLI and restful API.
- Superior to traditional chips for table sizes&ACLs required for cloud and edge.
- Comprehensive In-band Network Telemetry (INT) function detects network failure and identifies which and why packet drop.
- Proving a centralized SDN Controller, turning clusters of switches into a single virtual fabric.
Programmability features
- Supporting new protocols programmability.
- No impact on latency & throughput.
