In today’s fast-paced technological landscape, 800G optical transceivers have emerged as a groundbreaking innovation, poised to transform the way data is transmitted and processed. As artificial intelligence (AI), high-performance computing (HPC), and data-intensive applications continue to challenge the limits of network infrastructure, 800G modules are spearheading a new era of high-speed, high-capacity data communication. This article examines the evolution of 800G optical modules, delving into their technical standards, packaging, types, and applications. Whether you are dealing with the intricacies of AI-driven workloads or planning your next data centre upgrade, this guide will help you understand the transformative potential of 800G optical transceivers and make informed decisions.
What is an 800G Optical transceiver ?
An 800G optical module is a next-generation high-speed transmission device designed for environments that demand ultra-high bandwidth and low latency, such as data centers, communication networks, and HPC systems. With the ability to process 800 billion bits per second, these modules more than double the capacity of their predecessor, the 400G optical module, making them a critical enabler for modern AI and cloud computing applications
Key features of 800G optical modules include:
- High-density data transmission: Supports massive data flows in compact form factors.
- Energy efficiency: Designed to reduce power consumption while delivering exceptional performance.
- Scalability: Future-proofed for evolving network demands, including AI, IoT, and 5G applications.
Why Do We Need 800G Optical Modules?
The development of 800G modules is driven by the explosive growth of AI computing, HPC, and cloud services, which require faster, more efficient data transmission. Here are the key factors fueling their adoption:
- AI and HPC Workloads: AI models, such as ChatGPT and NVIDIA’s DGX H200 systems, demand unprecedented levels of data processing and bandwidth. These workloads rely on high-speed, low-latency networks, making 800G modules essential for scaling AI infrastructure
- Advancements in Switch Chip Technology: The 800G ecosystem is maturing alongside the release of 51.2T switch chips from industry leaders like Marvell, Cisco, and Broadcom. These chips enable the deployment of 800G optical modules on a large scale, ensuring compatibility with next-generation switches.
- Data Center Evolution: As data centers transition to hyperscale architectures, 800G modules provide the bandwidth and efficiency needed to handle massive data flows, reduce latency, and optimize energy consumption.
800G Optical Modules’ Technical Standards
The development of 800G optical modules is guided by industry standards and cutting-edge packaging technologies. These ensure interoperability, performance, and scalability across diverse network environments.
IEEE (Institute of Electrical and Electronics Engineers)Standard:
IEEE 802.3 IEEE 802.3 is the core standard for Ethernet. For 800G modules, IEEE provides specifications related to rates, physical layer interfaces (such as optical interfaces), and signal encoding. Key Specifications:
OIF (Optical Internetworking Forum)Standard:
OIF-CEI (Common Electrical I/O) Series Specifications OIF focuses on developing high-speed electrical interface standards that support high-speed signal transmission within 800G modules, such as electrical interfaces between the module and the motherboard.
Key Specifications:
- CEI-112G-XSR/VSR (Short/Ultra-short Range): Used for efficient connections between modules and motherboards.
- CEI-224G (Next-generation Standard): Provides specifications to support higher-speed requirements.
ITU-T (International Telecommunication Union – Telecommunication Standardization Sector)Standard:
G.709.x Series (OTN Standard) ITU-T standards mainly focus on the optical transport layer in telecommunication networks, defining the mapping and encapsulation of 800G modules in OTN (Optical Transport Network).
Key Specifications:
How 800Gbps signals are transmitted and multiplexed within the OTN architecture (e.g., ultra-wideband transmission).
QSFP-DD MSA (Multi-Source Agreement)Standard:
QSFP-DD 800 This protocol organization defines the packaging size, interface compatibility, thermal design, and electrical compatibility for 800G optical modules.
Key Specifications:
QSFP-DD (Quad Small Form-factor Pluggable Double Density) packaging, which is backward compatible with 400G QSFP-DD modules.
| Organize | Standard | Key points | Application Areas |
IEEE | IEEE 802.3 (Ethernet) | Define 800G Ethernet standards, including PAM4 modulation technology, to support high-speed signal transmission. Physical layer interface and rate specifications. 400Gx2 (dual channel) to achieve 800G. | High-speed Ethernet data transmission, data center, cloud computing infrastructure. |
OIF | OIF-CEI (Common Electrical l/O) | Electrical interface standards to support high-speed signal transmission of 800G modules. Define high-speed electrical interfaces such as CEI-112G-XSR/VSR, CEI-224G. Efficient data link transmission and electrical signal optimization. | High-speed electrical interfaces, data transmission and interconnection devices. |
ITU-T | G.709.x(OTN standard) | Define the encapsulation and mapping of 800G signals in OTN (Optical Transport Network). Optimize ultra-high-speed transmission in optical fiber networks. Provide multi-layer multiplexing and transmission capacity support. | Optical transmission in telecommunication networks, OTN High-speed transmission in architecture. |
| QSFP-DD MSA | QSFP-DD 800G | Define QSFP-DD (Double Density Quad Small Form Factor Pluggable) encapsulation and interface specifications to support 800G modules. Provide heat dissipation design, electrical compatibility and module size standards. Backward compatible with 400G QSFP-DD modules. | High-speed optical modules, data centers,network equipment. |
800G Module Packaging Types：
Currently, there are two mainstream packaging types for these modules: QSFP-DD and OSFP. Let’s explore each in detail.
QSFP-DD Packaging
QSFP-DD (Quad Small Form-Factor Pluggable Double Density) adopts dual-density, four-channel design, this compact and hot-swappable solution adheres to the IEEE 802.3bs and QSFP-DD MSA standards. It boasts 8 electrical channels, each capable of handling data rates of up to 25Gb/s (using NRZ modulation) or 50Gb/s (with PAM4 modulation), allowing for an impressive aggregated throughput of up to 200Gb/s or 400Gb/s. This makes it an excellent choice for high-speed data transmission applications.
Key Features:
- Dual-density design with up to 8 channels, maximizing signal density.
- Backward compatibility with existing 400G QSFP-DD modules and seamless integration with QSFP+/QSFP28/QSFP56 packages, ensuring compatibility with current infrastructure.
- Compact size, perfect for high-density applications.
Advantages:
- Strong compatibility and widespread adoption across various applications.
- Space-saving design, ideal for high-density switches and routers.
Drawbacks:
- Weaker heat dissipation, which can be a challenge in high-power density scenarios.
- Poor heat dissipation affects transmission quality and optical module life.
OSFP Packaging
On the other hand, OSFP (Octal Small Form-Factor Pluggable) is a newer and slightly larger option compared to QSFP-DD. It features 8 high-speed electrical channels and supports data rates of 200G, 400G, and even 800G. Common interfaces for OSFP include LC and MPO, with variations in the package shell, such as versions equipped with heat sinks or flat tops.
Key Features:
- 8-channel design, enabling data transmission of up to 800G.
- Higher current-carrying capacity, making it suitable for high-power modules.
- Improved heat dissipation, ideal for high-power density devices.
Advantages:
- Superior heat dissipation, making it well-suited for large-scale data centers and high-performance computing environments.
- Future-proof design: The larger size accommodates higher power consumption, supporting future rates of 1.6T or more.
Drawbacks:
- Larger package size, which occupies more physical space.
- Limited compatibility, primarily designed for specific equipment.
800G Module Packaging: QSFP-DD or OSFP?Which to Choose?
| QSFP-DD Packaging | OSFP Packaging | |
| Type | Quad Small Form-Factor Pluggable Double Density | Octal Small Form-Factor Pluggable |
| Design | 4-channel/ 8-channel design | 8-channel design |
| Data Rate | Up to 200G/400G (25Gb/s or 50Gb/s per channel)//800G | Up to 200G, 400G, 800G |
| Modulation | NRZ (25Gb/s) or PAM4 (50Gb/s) | Generally uses higher modulation (PAM4,etc.) for higher speeds |
| Compatibility | backward compatible QSFP28, QSFP+, QSFP56 | Limited compatibility,primarily for OSFP-compatible devices |
| Power Consumption | Lower power consumption compared to OSFP | Higher power consumption due to larger size and higher capacity |
| Heat Dissipation | Weaker heat dissipation, not ideal for high-power applications | Superior heat dissipation, better for high-power density environments |
| Size | Compact, space-saving, ideal for high-density applications | Larger package, requires more physical space |
| Future Proof Design | Limited, supports up to 800G | Very future-proof, supports up to 1.6T or higher |
| Best Suited For | High-density switches, routers, telecommunications applications | Large-scale data centers, high-performance computing, future-proofing |
| Advantages | -Strong compatibility with existing infrastructure | -Superior heat dissipation |
| -Compact, ideal for high-density applications | -Future-proof, supports higher power and future rates,can easy upgrade network | |
| Drawbacks | -Weaker heat dissipation, struggles in high-power density scenarios, Poor heat dissipation affects transmission quality and optical module life | -Larger size, limited compatibility |
| Typical Application | Telecommunications, high-density network environments | Data centers, high-performance computing, large-scale environments |
When deciding between QSFP-DD and OSFP, consider your specific application requirements:
- Size: OSFP is slightly larger than QSFP-DD.
- Power Consumption: OSFP generally consumes more power than QSFP-DD.
- Compatibility: QSFP-DD is fully compatible with QSFP28 and QSFP+ modules, while OSFP has limited compatibility.
Application Considerations:
- If you need higher density and space savings, and your application has less demanding heat dissipation needs, QSFP-DD might be the better choice.
- Conversely, if your application requires higher power capacity and better heat dissipation, and you’re less concerned about space constraints, OSFP would be the more suitable option.
- QSFP-DD is typically preferred in telecommunications applications, while OSFP is more suitable for data center environments.
In summary, both QSFP-DD and OSFP have their unique strengths and ideal use cases, so your choice should align with your specific needs and infrastructure!
FAQs About 800G OSFP and QSFP-DD Modules
Q1: Can an OSFP interface module be plugged into a QSFP-DD interface?
A1: Unfortunately, no! The OSFP and QSFP-DD modules are designed with different physical sizes and connection methods, which means they are not compatible with each other. Think of it like trying to fit a square peg into a round hole—it’s just not going to work!
Q2: Can an OSFP at one end of an 800G link interoperate with a QSFP-DD at the other end?
A2: Yes, they can! While OSFP and QSFP-DD refer to different physical form factors, they can interoperate as long as the Ethernet media type is the same. This means you can mix and match these modules in your network setup, giving you flexibility in your design!
Q3: Does Asterfusion sell the corresponding 800G/51.2T switch? Can I learn more about it?
A3: Absolutely! Asterfusion offers a cutting-edge 800G switch, specifically our self-developed 800G/51.2T switch, which is powered by our enterprise version of SONiC NOS—AsterNOS. This switch is engineered to meet the demanding requirements of various applications, including AI, machine learning, data centers, high-performance computing (HPC), and distributed storage. Curious to learn more? Check out Asterfusion’s product page for all the details! 64 x 800G Switch Ultra Ethernet, 51.2Tbps, Marvell Teralynx 10, For AI/ML/Cloud Data Center/HPC
Join the Conversation!
Have more questions about 800G Module OSFP, QSFP-DD, or Asterfusion’s products? Let’s discuss! Share your thoughts or inquiries in the comments below. Your insights could spark a great conversation.
