Asterfusion SONiC NOS based low latency data center switches from 2Tbps to 12.8Tbps
Asterfusion offers 2 Tbps -12.8 Tbps data centers’ leaf and spine switch based on Teralynx chip, it preloaded with SONiC enterprise distribution which provides users a simple, plug-and-play deployment and turnkey solution.
SONiC NOS based Ultra low latency data center switches based on Marvell Teralynx
—Essential by distributed storage, AI applications and HPC, NVME.
Highest Scale and Radix Solutions
- Up to 128x 100GbE, 64x 100G + 16 x 400G or 32x 400GbE.
- Up to 12.8T switch capacity.
—Leading Performance/$ and Performance/W
- The largest on-chip buffer among similar switches, providing first-class microburst elimination.
- Robust tunneling features with VXLAN/MPLS.
- Powerful QoS features for RoCEv2/RDMA, easy to use with both CLI and restful API.
- Superior to traditional chips for table sizes&ACLs required for cloud and edge.
- Comprehensive In-band Network Telemetry (INT) function detects network failure and identifies which and why packet drop.
- Proving a centralized SDN Controller, turning clusters of switches into a single virtual fabric.
- Support EVPN Mutihoming for network redundancy and high availability in data center environments.
—Programmability features
- Supporting new protocols programmability.
- No impact on latency & throughput.
Application Scenarios for Asterfusion SONiC-NOS based Data Center Switches
Asterfusion Leaf and Spine Topology for Data Center or CORD
- Leaf and spine architecture can effortlessly scale from a few racks with L2 fabric to thousands of racks with L3 fabric.
- The Asterfusion open network switches offer a wide range of choices for server connections, including 1G, 10G, 25G, 100G, as well as spine network options like 10G, 40G, 100G, and even 400G.
- To enhance the network underlay, the folded CLOS fabric provides robust support for SDN, virtualization, and cloud orchestration software alternatives.
